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Rochester Electronics 2N6071ATG

4 QUADRANT LOGIC LEVEL TRIAC, 20
part number has RoHS
Manufacturer # :2N6071ATG
Manufacturer :Rochester Electronics
Dasenic # :2N6071ATG-DS
Customer # :
Description : 4 QUADRANT LOGIC LEVEL TRIAC, 20
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.2150$ 0.22
25+$ 0.2107$ 5.27
100+$ 0.2021$ 20.21
500+$ 0.1935$ 96.75
1000+$ 0.1828$ 182.8
In Stock: 13350
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.215
Total :$ 0.21
Delivery :
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Payment :
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2N6071ATG information

  • Rochester Electronics 2N6071ATG technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Thyristors - TRIACs
  • Product Status:Active
  • Operating Temperature:-40°C ~ 110°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-225AA, TO-126-3
  • Supplier Device Package:TO-225-3
  • Configuration:Single
  • Current - Hold ( Ih) ( Max):15 mA
  • Voltage - Off State:200 V
  • Current - On State ( It ( R M S)) ( Max):4 A
  • Voltage - Gate Trigger ( Vgt) ( Max):2.5 V
  • Current - Gate Trigger ( Igt) ( Max):5 mA
  • Current - Non Rep. Surge 50, 60 Hz ( Itsm):30A @ 60Hz
  • Triac Type:Logic - Sensitive Gate
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
2N6071ATG provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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