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Kioxia America, Inc. THGBMHG8C4LBAW7
IC FLASH MEM MMC 169VFBGA
Manufacturer # :THGBMHG8C4LBAW7
Manufacturer :Kioxia America, Inc.
Dasenic # :THGBMHG8C4LBAW7-DS
Datasheet :
THGBMHG8C4LBAW7 Datasheet
THGBMHG8C4LBAW7 DatasheetCustomer # :
Description : IC FLASH MEM MMC 169VFBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.9000 | $ 0.9 |
| 10+ | $ 0.8550 | $ 8.55 |
| 100+ | $ 0.8100 | $ 81 |
| 1000+ | $ 0.7200 | $ 720 |
| 10000+ | $ 0.6750 | $ 6750 |
In Stock: 21727
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.9
Total :$ 0.90
Delivery :
Payment :
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THGBMHG8C4LBAW7 information
Kioxia America, Inc. THGBMHG8C4LBAW7 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Obsolete
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:-
- Technology:-
- Supplier Device Package:169-VFBGA (11.5x13)
- Memory Size:-
- Memory Type:-
- Voltage - Supply:-
- Clock Frequency:-
- Access Time:-
- Memory Format:-
- Memory Interface:-
- Write Cycle Time - Word, Page:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991B1A
- HTS US:8542.32.0071
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
THGBMHG8C4LBAW7 provided by Kioxia America, Inc.
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the US-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.
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