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1 : $3.9510
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Kioxia America, Inc. TH58BYG2S3HBAI4
IC FLASH 4GBIT 63TFBGA
Manufacturer # :TH58BYG2S3HBAI4
Manufacturer :Kioxia America, Inc.
Dasenic # :TH58BYG2S3HBAI4-DS
Datasheet :
TH58BYG2S3HBAI4 Datasheet
TH58BYG2S3HBAI4 DatasheetCustomer # :
Description : IC FLASH 4GBIT 63TFBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 3.9510 | $ 3.95 |
| 10+ | $ 3.4110 | $ 34.11 |
| 100+ | $ 3.4020 | $ 340.2 |
| 210+ | $ 3.1140 | $ 653.94 |
| 1050+ | $ 3.1050 | $ 3260.25 |
In Stock: 1708
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.951
Total :$ 3.95
Delivery :
Payment :
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TH58BYG2S3HBAI4 information
Kioxia America, Inc. TH58BYG2S3HBAI4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:63-VFBGA
- Technology:FLASH - NAND (SLC)
- Supplier Device Package:63-TFBGA (9x11)
- Memory Size:4Gb (512M x 8)
- Memory Type:Non-Volatile
- Voltage - Supply:-
- Clock Frequency:-
- Access Time:-
- Memory Format:Flash
- Memory Interface:-
- Write Cycle Time - Word, Page:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991B1A
- HTS US:8542.32.0071
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TH58BYG2S3HBAI4 provided by Kioxia America, Inc.
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the US-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.
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