1 / 1

1 : $3.9510

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Kioxia America, Inc. TH58BYG2S3HBAI4

Name: TH58BYG2S3HBAI4
Brand: Kioxia America, Inc.
SKU: TH58BYG2S3HBAI4-DS
Price: 3.9510 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 1708

MOQ: 1

2 Price Tiers

Mfr.Part # :TH58BYG2S3HBAI4
Manufacturer :Kioxia America, Inc.
Dasenic # :TH58BYG2S3HBAI4-DS
Datasheet : TH58BYG2S3HBAI4 Datasheet PDF
Description : IC FLASH 4GBIT 63TFBGA
Package :-
Unit Price: $3.9510
Total: $3.95

Quantity	Unit Price	You Save
1-1	$3.9510	-
2-10	$3.4110	13.7% save

Help you to save your cost and time

Strict quality inspection and Reliable package for goods

Fast Reliable delivery to save time

Provide 365 days warranty after-sales service

Kioxia America, Inc. TH58BYG2S3HBAI4 technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Memory Integrated Circuit

Product Status:Active

Operating Temperature:-40°C ~ 85°C

Mounting Type:Surface Mount

Package / Case:63-VFBGA

Technology:FLASH - NAND (SLC)

Supplier Device Package:63-TFBGA (9x11)

Memory Size:4Gb (512M x 8)

Memory Type:Non-Volatile

Voltage - Supply:-

Clock Frequency:-

Access Time:-

Memory Format:Flash

Memory Interface:-

Write Cycle Time - Word, Page:-

EU RoHS Status:ROHS3 Compliant

MSL Rating:3 (168 Hours,30°C/60%RH)

REACH Status:REACH Unaffected

US ECCN:3A991B1A

HTS US:8542.32.0071

China RoHS Status:Green Symbol: Green and environmentally friendly product

TH58BYG2S3HBAI4 provided by Kioxia America, Inc.

KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the US-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.