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Kioxia America, Inc. THGBMFG6C1LBAIL

IC FLASH 64G EMMC 153-FBGA
part number has RoHS
Manufacturer # :THGBMFG6C1LBAIL
Manufacturer :Kioxia America, Inc.
Dasenic # :THGBMFG6C1LBAIL-DS
Customer # :
Description : IC FLASH 64G EMMC 153-FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
9+$ 5.0877$ 45.79
22+$ 4.1742$ 91.83
34+$ 4.0437$ 137.49
46+$ 3.9132$ 180.01
60+$ 3.7827$ 226.96
In Stock: 15644
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.0877
Total :$ 5.09
Delivery :
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Payment :
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THGBMFG6C1LBAIL information

  • Kioxia America, Inc. THGBMFG6C1LBAIL technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:-
  • Technology:-
  • Supplier Device Package:153-FBGA (11.5x13)
  • Memory Size:-
  • Memory Type:-
  • Voltage - Supply:-
  • Clock Frequency:-
  • Access Time:-
  • Memory Format:-
  • Memory Interface:-
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:OBSOLETE
  • HTS US:0000.00.0000
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
THGBMFG6C1LBAIL provided by Kioxia America, Inc.
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the US-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.
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