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Kioxia America, Inc. THGAMRT0T43BAIR

IC FLASH 1T BIT EMMC 153FBGA
part number has RoHS
Manufacturer # :THGAMRT0T43BAIR
Manufacturer :Kioxia America, Inc.
Dasenic # :THGAMRT0T43BAIR-DS
Customer # :
Description : IC FLASH 1T BIT EMMC 153FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
2+$ 35.3808$ 70.76
3+$ 33.0984$ 99.3
5+$ 31.9572$ 159.79
7+$ 29.6739$ 207.72
8+$ 28.5327$ 228.26
In Stock: 3042
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 35.3808
Total :$ 35.38
Delivery :
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Payment :
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THGAMRT0T43BAIR information

  • Kioxia America, Inc. THGAMRT0T43BAIR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Last Time Buy
  • Operating Temperature:-25°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:153-WFBGA
  • Technology:FLASH - NAND
  • Supplier Device Package:153-WFBGA (11.5x13)
  • Memory Size:1Tb (128G x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:-
  • Clock Frequency:-
  • Access Time:-
  • Memory Format:Flash
  • Memory Interface:eMMC
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991B1A
  • HTS US:8542.32.0071
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
THGAMRT0T43BAIR provided by Kioxia America, Inc.
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the US-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.
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