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Kioxia America, Inc. THGAMRG9T23BAIL

IC FLASH 512GBIT EMMC 153FBGA
part number has RoHS
Manufacturer # :THGAMRG9T23BAIL
Manufacturer :Kioxia America, Inc.
Dasenic # :THGAMRG9T23BAIL-DS
Customer # :
Description : IC FLASH 512GBIT EMMC 153FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 12.6783$ 12.68
10+$ 11.8332$ 118.33
100+$ 10.9881$ 1098.81
1000+$ 10.5651$ 10565.1
10000+$ 10.2276$ 102276
In Stock: 32647
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.6783
Total :$ 12.68
Delivery :
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Payment :
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THGAMRG9T23BAIL information

  • Kioxia America, Inc. THGAMRG9T23BAIL technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Last Time Buy
  • Operating Temperature:-25°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:153-WFBGA
  • Technology:FLASH - NAND
  • Supplier Device Package:153-WFBGA (11.5x13)
  • Memory Size:512Gb (64G x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:-
  • Clock Frequency:-
  • Access Time:-
  • Memory Format:Flash
  • Memory Interface:eMMC
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991B1A
  • HTS US:8542.32.0071
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
THGAMRG9T23BAIL provided by Kioxia America, Inc.
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the US-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.
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