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Kioxia America, Inc. TC58NVG1S3ETA00

IC FLASH 2GBIT PARALLEL 48TSOP I
part number has RoHS
Manufacturer # :TC58NVG1S3ETA00
Manufacturer :Kioxia America, Inc.
Dasenic # :TC58NVG1S3ETA00-DS
Customer # :
Description : IC FLASH 2GBIT PARALLEL 48TSOP I
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
11+$ 4.3843$ 48.23
22+$ 4.1015$ 90.23
35+$ 3.9600$ 138.6
49+$ 3.6771$ 180.18
64+$ 3.5357$ 226.28
In Stock: 14400
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.3843
Total :$ 4.38
Delivery :
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Payment :
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TC58NVG1S3ETA00 information

  • Kioxia America, Inc. TC58NVG1S3ETA00 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TFSOP (0.724", 18.40mm Width)
  • Technology:FLASH - NAND (SLC)
  • Supplier Device Package:48-TSOP I
  • Memory Size:2Gb (256M x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:2.7V ~ 3.6V
  • Clock Frequency:-
  • Access Time:25 ns
  • Memory Format:Flash
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:25ns
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991B1A
  • HTS US:8542.32.0051
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TC58NVG1S3ETA00 provided by Kioxia America, Inc.
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the US-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.
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