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Kioxia America, Inc. TC58CYG2S0HRAIJ

IC FLASH 4GBIT SPI 133MHZ 8WSON
part number has RoHS
Manufacturer # :TC58CYG2S0HRAIJ
Manufacturer :Kioxia America, Inc.
Dasenic # :TC58CYG2S0HRAIJ-DS
Customer # :
Description : IC FLASH 4GBIT SPI 133MHZ 8WSON
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 11.8128$ 118.13
480+$ 9.8440$ 4725.12
500+$ 9.7460$ 4873
1000+$ 9.6480$ 9648
2000+$ 9.5520$ 19104
In Stock: 2828
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.8128
Total :$ 11.81
Delivery :
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Payment :
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TC58CYG2S0HRAIJ information

  • Kioxia America, Inc. TC58CYG2S0HRAIJ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Technology:FLASH - NAND (SLC)
  • Supplier Device Package:8-WSON (6x8)
  • Memory Size:4Gb (512M x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:1.7V ~ 1.95V
  • Clock Frequency:133 MHz
  • Access Time:300 µs
  • Memory Format:Flash
  • Memory Interface:SPI
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991B1A
  • HTS US:8542.32.0071
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TC58CYG2S0HRAIJ provided by Kioxia America, Inc.
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the US-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.
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