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1 : $2.7450
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Kioxia America, Inc. TC58BVG0S3HTA00
IC FLASH 1GBIT PARALLEL 48TSOP I
Manufacturer # :TC58BVG0S3HTA00
Manufacturer :Kioxia America, Inc.
Dasenic # :TC58BVG0S3HTA00-DS
Datasheet :
TC58BVG0S3HTA00 Datasheet
TC58BVG0S3HTA00 DatasheetCustomer # :
Description : IC FLASH 1GBIT PARALLEL 48TSOP I
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.7450 | $ 2.75 |
| 10+ | $ 2.4408 | $ 24.41 |
| 25+ | $ 2.7450 | $ 68.63 |
| 40+ | $ 2.2721 | $ 90.88 |
| 96+ | $ 2.1714 | $ 208.45 |
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.745
Total :$ 2.75
Delivery :
Payment :
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TC58BVG0S3HTA00 information
Kioxia America, Inc. TC58BVG0S3HTA00 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:48-TFSOP (0.724", 18.40mm Width)
- Technology:FLASH - NAND (SLC)
- Supplier Device Package:48-TSOP I
- Memory Size:1Gb (128M x 8)
- Memory Type:Non-Volatile
- Voltage - Supply:2.7V ~ 3.6V
- Clock Frequency:-
- Access Time:25 ns
- Memory Format:Flash
- Memory Interface:Parallel
- Write Cycle Time - Word, Page:25ns
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TC58BVG0S3HTA00 provided by Kioxia America, Inc.
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the US-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.
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