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Rochester Electronics EPXA1F484C2

LOADABLE PLD, PBGA484
part number has RoHS
Manufacturer # :EPXA1F484C2
Manufacturer :Rochester Electronics
Dasenic # :EPXA1F484C2-DS
Customer # :
Description : LOADABLE PLD, PBGA484
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 41.7515$ 41.75
100+$ 40.0814$ 4008.14
500+$ 38.4782$ 19239.1
1000+$ 36.9390$ 36939
In Stock: 1757
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 41.7515
Total :$ 41.75
Delivery :
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Payment :
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EPXA1F484C2 information

  • Rochester Electronics EPXA1F484C2 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array) with Microcontrollers
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:484-BBGA
  • Interface:EBI/EMI, UART/USART
  • Supplier Device Package:484-FBGA (23x23)
  • Voltage - Supply:1.8V
  • Core Type:32-Bit ARM9
  • Speed:200 MHz
  • Program S R A M Bytes:32k
  • F P G A S R A M:-
  • E E P R O M Size:-
  • Data S R A M Bytes:16k
  • F P G A Core Cells:4160
  • F P G A Gates:100k
  • F P G A Registers:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
EPXA1F484C2 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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