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Rochester Electronics EPM7032SLC44-6

EE PLD, 6NS, 32-CELL, CMOS
part number has RoHS
Manufacturer # :EPM7032SLC44-6
Manufacturer :Rochester Electronics
Dasenic # :EPM7032SLC44-6-DS
Customer # :
Description : EE PLD, 6NS, 32-CELL, CMOS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 15.0480$ 15.05
25+$ 14.7510$ 368.78
100+$ 14.1480$ 1414.8
500+$ 13.5450$ 6772.5
1000+$ 12.7890$ 12789
In Stock: 4422
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 15.048
Total :$ 15.05
Delivery :
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EPM7032SLC44-6 information

  • Rochester Electronics EPM7032SLC44-6 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:44-LCC (J-Lead)
  • Supplier Device Package:44-PLCC (16.59x16.59)
  • Programmable Type:In System Programmable
  • Delay Time tpd(1) Max:6 ns
  • Voltage Supply - Internal:4.75V ~ 5.25V
  • Number of Logic Elements/ Blocks:2
  • Number of Macrocells:32
  • Number of I/ O:36
  • Number of gates:600
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
EPM7032SLC44-6 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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