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Rochester Electronics EPM7032BUC49-7

EE PLD, 3.5NS, 32-CELL, PBGA49
part number has RoHS
Manufacturer # :EPM7032BUC49-7
Manufacturer :Rochester Electronics
Dasenic # :EPM7032BUC49-7-DS
Customer # :
Description : EE PLD, 3.5NS, 32-CELL, PBGA49
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.2600$ 1.26
25+$ 1.2330$ 30.83
100+$ 1.1880$ 118.8
500+$ 1.1340$ 567
1000+$ 1.0710$ 1071
In Stock: 3951
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.26
Total :$ 1.26
Delivery :
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Payment :
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EPM7032BUC49-7 information

  • Rochester Electronics EPM7032BUC49-7 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:49-LFBGA
  • Supplier Device Package:49-UBGA (7x7)
  • Programmable Type:In System Programmable
  • Delay Time tpd(1) Max:7.5 ns
  • Voltage Supply - Internal:2.375V ~ 2.625V
  • Number of Logic Elements/ Blocks:2
  • Number of Macrocells:32
  • Number of I/ O:36
  • Number of gates:600
  • EU RoHS Status:RoHS non-compliant
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
EPM7032BUC49-7 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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