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Rochester Electronics EPM2210GF324C3

FLASH PLD, 7NS, 1700-CELL PBGA32
part number has RoHS
Manufacturer # :EPM2210GF324C3
Manufacturer :Rochester Electronics
Dasenic # :EPM2210GF324C3-DS
Customer # :
Description : FLASH PLD, 7NS, 1700-CELL PBGA32
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 198.9800$ 198.98
25+$ 195.0000$ 4875
100+$ 187.0400$ 18704
500+$ 179.0800$ 89540
1000+$ 169.1400$ 169140
In Stock: 1518
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 198.98
Total :$ 198.98
Delivery :
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EPM2210GF324C3 information

  • Rochester Electronics EPM2210GF324C3 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
  • Product Status:Active
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:324-BGA
  • Supplier Device Package:324-FBGA (19x19)
  • Programmable Type:In System Programmable
  • Delay Time tpd(1) Max:7 ns
  • Voltage Supply - Internal:1.71V ~ 1.89V
  • Number of Logic Elements/ Blocks:2210
  • Number of Macrocells:1700
  • Number of I/ O:272
  • Number of gates:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
EPM2210GF324C3 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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