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Rochester Electronics EPM2210GF256C4N

FLASH PLD, 9.1NS, 1700-CELL PBGA
part number has RoHS
Manufacturer # :EPM2210GF256C4N
Manufacturer :Rochester Electronics
Dasenic # :EPM2210GF256C4N-DS
Customer # :
Description : FLASH PLD, 9.1NS, 1700-CELL PBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 144.4600$ 144.46
25+$ 141.5800$ 3539.5
100+$ 135.8000$ 13580
500+$ 130.0200$ 65010
1000+$ 122.8000$ 122800
In Stock: 1503
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 144.46
Total :$ 144.46
Delivery :
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EPM2210GF256C4N information

  • Rochester Electronics EPM2210GF256C4N technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
  • Product Status:Active
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA
  • Supplier Device Package:256-FBGA (17x17)
  • Programmable Type:In System Programmable
  • Delay Time tpd(1) Max:7 ns
  • Voltage Supply - Internal:1.71V ~ 1.89V
  • Number of Logic Elements/ Blocks:2210
  • Number of Macrocells:1700
  • Number of I/ O:204
  • Number of gates:-
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A001A7A
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
EPM2210GF256C4N provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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