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Rochester Electronics EPF8820ARC208-3
IC FPGA 152 I/O 208RQFP
Manufacturer # :EPF8820ARC208-3
Manufacturer :Rochester Electronics
Dasenic # :EPF8820ARC208-3-DS
Datasheet :
EPF8820ARC208-3 Datasheet
EPF8820ARC208-3 DatasheetCustomer # :
Description : IC FPGA 152 I/O 208RQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 54.7560 | $ 54.76 |
| 25+ | $ 53.6580 | $ 1341.45 |
| 100+ | $ 51.4710 | $ 5147.1 |
| 500+ | $ 49.2840 | $ 24642 |
| 1000+ | $ 46.5390 | $ 46539 |
In Stock: 1610
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 54.756
Total :$ 54.76
Delivery :
Payment :
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EPF8820ARC208-3 information
Rochester Electronics EPF8820ARC208-3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:208-BFQFP Exposed Pad
- Supplier Device Package:208-RQFP (28x28)
- Voltage - Supply:4.75V ~ 5.25V
- Number of I/ O:152
- Number of L A Bs/ C L Bs:84
- Number of Logic Elements/ Cells:672
- Number of gates:8000
- Total R A M bits:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
EPF8820ARC208-3 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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