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1 : $110.3940
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Rochester Electronics EPF10K30AQC208-1
IC FPGA 147 I/O 208QFP
Manufacturer # :EPF10K30AQC208-1
Manufacturer :Rochester Electronics
Dasenic # :EPF10K30AQC208-1-DS
Datasheet :
EPF10K30AQC208-1 Datasheet
EPF10K30AQC208-1 DatasheetCustomer # :
Description : IC FPGA 147 I/O 208QFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 110.3940 | $ 110.39 |
| 25+ | $ 108.1890 | $ 2704.73 |
| 100+ | $ 103.7700 | $ 10377 |
| 500+ | $ 99.3510 | $ 49675.5 |
| 1000+ | $ 93.8340 | $ 93834 |
In Stock: 1542
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 110.394
Total :$ 110.39
Delivery :
Payment :
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EPF10K30AQC208-1 information
Rochester Electronics EPF10K30AQC208-1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:208-BFQFP
- Supplier Device Package:208-PQFP (28x28)
- Voltage - Supply:4.75V ~ 5.25V
- Number of I/ O:147
- Number of L A Bs/ C L Bs:216
- Number of Logic Elements/ Cells:1728
- Number of gates:69000
- Total R A M bits:12288
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EPF10K30AQC208-1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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