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1 : $1.6740
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Rochester Electronics IRS21094PBF
IRS21094 - GATE DRIVER
Manufacturer # :IRS21094PBF
Manufacturer :Rochester Electronics
Dasenic # :IRS21094PBF-DS
Datasheet :
IRS21094PBF Datasheet
IRS21094PBF DatasheetCustomer # :
Description : IRS21094 - GATE DRIVER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.6740 | $ 1.67 |
| 3+ | $ 1.5750 | $ 4.73 |
In Stock: 11580
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.674
Total :$ 1.67
Delivery :
Payment :
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IRS21094PBF information
Rochester Electronics IRS21094PBF technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Gate Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:14-DIP (0.300", 7.62mm)
- Input Type:Non-Inverting
- Supplier Device Package:14-DIP
- Voltage - Supply:10V ~ 20V
- Channel Type:Synchronous
- Driven Configuration:Half-Bridge
- Number of Drivers:2
- Gate Type:IGBT, N-Channel MOSFET
- Logic Voltage - V I L, V I H:0.8V, 2.5V
- Current - Peak Output ( Source, Sink):290mA, 600mA
- High Side Voltage - Max ( Bootstrap):600 V
- Rise / Fall Time ( Typ):100ns, 35ns
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
IRS21094PBF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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