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Rochester Electronics IRF7311PBF

HEXFET POWER MOSFET
part number has RoHS
Manufacturer # :IRF7311PBF
Manufacturer :Rochester Electronics
Dasenic # :IRF7311PBF-DS
Customer # :
Description : HEXFET POWER MOSFET
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.6800$ 1.68
In Stock: 2914
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.68
Total :$ 1.68
Delivery :
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IRF7311PBF information

  • Rochester Electronics IRF7311PBF technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Arrays
  • Product Status:Active
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Power - Max:2W
  • Supplier Device Package:8-SO
  • F E T Type:2 N-Channel (Dual)
  • F E T Feature:Logic Level Gate
  • Drain to Source Voltage ( Vdss):20V
  • Current - Continuous Drain ( Id) @ 25° C:6.6A
  • Rds On ( Max) @ Id, Vgs:29mOhm @ 6A, 4.5V
  • Vgs(th) ( Max) @ Id:700mV @ 250µA
  • Gate Charge ( Qg) ( Max) @ Vgs:27nC @ 4.5V
  • Input Capacitance ( Ciss) ( Max) @ Vds:900pF @ 15V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:0000.00.0000
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
IRF7311PBF provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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