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Rochester Electronics DDB6U205N16LHOSA1

DDB6U205N16L - EUPEC ISOPACK- 16
part number has RoHS
Manufacturer # :DDB6U205N16LHOSA1
Manufacturer :Rochester Electronics
Dasenic # :DDB6U205N16LHOSA1-DS
Customer # :
Description : DDB6U205N16L - EUPEC ISOPACK- 16
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 406.4600$ 406.46
12+$ 380.6917$ 4568.3
28+$ 366.3793$ 10258.62
In Stock: 1504
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 406.46
Total :$ 406.46
Delivery :
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Payment :
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DDB6U205N16LHOSA1 information

  • Rochester Electronics DDB6U205N16LHOSA1 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
  • Product Status:Active
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Speed:-
  • Diode Type:-
  • Voltage - Forward ( Vf) ( Max) @ If:-
  • Current - Reverse Leakage @ Vr:-
  • Diode Configuration:-
  • Voltage - D C Reverse ( Vr) ( Max):-
  • Current - Average Rectified ( Io) (per Diode):-
  • Reverse Recovery Time (trr):-
  • Operating Temperature - Junction:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:Vendor omitted MSL Rating information
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8541.10.0080
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DDB6U205N16LHOSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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