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Rochester Electronics BSM75GB120DN2HOSA1

MEDIUM POWER 34MM
part number has RoHS
Manufacturer # :BSM75GB120DN2HOSA1
Manufacturer :Rochester Electronics
Dasenic # :BSM75GB120DN2HOSA1-DS
Customer # :
Description : MEDIUM POWER 34MM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 172.9400$ 172.94
25+$ 169.4800$ 4237
100+$ 162.5600$ 16256
500+$ 155.6400$ 77820
1000+$ 147.0000$ 147000
In Stock: 1508
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 172.94
Total :$ 172.94
Delivery :
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BSM75GB120DN2HOSA1 information

  • Rochester Electronics BSM75GB120DN2HOSA1 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Power - Max:-
  • Supplier Device Package:-
  • Configuration:-
  • Input:-
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):-
  • Current - Collector Cutoff ( Max):-
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:-
  • Input Capacitance ( Cies) @ Vce:-
  • N T C Thermistor:-
  • MSL Rating:Vendor omitted MSL Rating information
  • REACH Status:REACH Unaffected
  • EU RoHS Status:RoHS Compliant
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BSM75GB120DN2HOSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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