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1 : $87.3000
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FTDI Chip USB-COM422-PLUS4
Interface Modules USB HS to RS422 Conv Assembly 4 DB9 Port
Manufacturer # :USB-COM422-PLUS4
Manufacturer :FTDI Chip
Dasenic # :USB-COM422-PLUS4-DS
Datasheet :
USB-COM422-PLUS4 Datasheet
USB-COM422-PLUS4 DatasheetCustomer # :
Description : Interface Modules USB HS to RS422 Conv Assembly 4 DB9 Port
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 87.3000 | $ 87.3 |
| 5+ | $ 83.4300 | $ 417.15 |
| 10+ | $ 79.5600 | $ 795.6 |
| 25+ | $ 75.6900 | $ 1892.25 |
| 50+ | $ 75.2670 | $ 3763.35 |
In Stock: 1691
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 87.3
Total :$ 87.30
Delivery :
Payment :
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USB-COM422-PLUS4 information
FTDI Chip USB-COM422-PLUS4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Modules
- Data Rate:10 Mbps, 480 Mbps
- Operating Supply Voltage:5 V
- Packaging:Box
- Dimensions:138 mm x 44.5 mm
- Part # Aliases:USB-COM422-PLUS-4
- Minimum Operating Temperature:- 40 C
- Maximum Operating Temperature:+ 85 C
- Interface Type:RS-422, USB
- Number of Channels / Ports:4
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
USB-COM422-PLUS4 provided by FTDI Chip
Founded in 1992, FTDI (Future Technology Devices International Limited) Chip is a company that specializes in the design and manufacture of semiconductor solutions for various electronic applications, particularly in the field of USB connectivity.
FTDI's continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality.
Our main objective is to bridge technologies and provide engineers with highly sophisticated, feature-rich, robust, and user-friendly product platforms.
The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai.
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