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FTDI Chip FT4232HQ-TRAY
IC: interface; USB-UART x4, MPSSE x2; Hi-Speed; 3.3÷5VDC; QFN64
Manufacturer # :FT4232HQ-TRAY
Manufacturer :FTDI Chip
Dasenic # :FT4232HQ-TRAY-DS
Datasheet :
FT4232HQ-TRAY Datasheet
FT4232HQ-TRAY DatasheetCustomer # :
Description : IC: interface; USB-UART x4, MPSSE x2; Hi-Speed; 3.3÷5VDC; QFN64
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 8+ | $ 5.9785 | $ 47.83 |
| 17+ | $ 5.5929 | $ 95.08 |
| 25+ | $ 5.4000 | $ 135 |
| 36+ | $ 5.0143 | $ 180.51 |
| 47+ | $ 4.8214 | $ 226.61 |
In Stock: 16272
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.9785
Total :$ 5.98
Delivery :
Payment :
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FT4232HQ-TRAY information
FTDI Chip FT4232HQ-TRAY technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Controllers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Package / Case:64-VFQFN Exposed Pad
- Current - Supply:70mA
- Functions:Bridge, USB to UART
- Interface:UART
- Supplier Device Package:64-QFN (9x9)
- Standards:USB 2.0
- Voltage - Supply:3V ~ 3.6V
- Protocol:USB
- Series:USBmadeEZ-FIFO
- Base Product Number:FT4232
- Packaging:Tray
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FT4232HQ-TRAY provided by FTDI Chip
Founded in 1992, FTDI (Future Technology Devices International Limited) Chip is a company that specializes in the design and manufacture of semiconductor solutions for various electronic applications, particularly in the field of USB connectivity.
FTDI's continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality.
Our main objective is to bridge technologies and provide engineers with highly sophisticated, feature-rich, robust, and user-friendly product platforms.
The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai.
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