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1 : $59.7600
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FTDI Chip USB-COM422-PLUS2
MOD USB HS RS422 CONVERTER 2 CH
Manufacturer # :USB-COM422-PLUS2
Manufacturer :FTDI Chip
Dasenic # :USB-COM422-PLUS2-DS
Datasheet :
USB-COM422-PLUS2 Datasheet
USB-COM422-PLUS2 DatasheetCustomer # :
Description : MOD USB HS RS422 CONVERTER 2 CH
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 59.7600 | $ 59.76 |
| 5+ | $ 57.0600 | $ 285.3 |
| 10+ | $ 54.3600 | $ 543.6 |
| 25+ | $ 51.6600 | $ 1291.5 |
| 50+ | $ 51.0750 | $ 2553.75 |
In Stock: 1594
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 59.76
Total :$ 59.76
Delivery :
Payment :
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USB-COM422-PLUS2 information
FTDI Chip USB-COM422-PLUS2 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Modules
- Product Status:Active
- Features:LED Indicator
- Type:USB to Serial
- Interface:RS-422, UART
- Convert From ( Adapter End):USB - B 2.0 Female
- Convert To ( Adapter End):D-Sub 09 Pos (DB9) Male (2)
- Utilized I C / Part:FT2232H
- Series:USB-COM-Plus
- Base Product Number:USB-COM422
- Packaging:Bulk
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8473.30.1180
- China RoHS Status:Green Symbol: Green and environmentally friendly product
USB-COM422-PLUS2 provided by FTDI Chip
Founded in 1992, FTDI (Future Technology Devices International Limited) Chip is a company that specializes in the design and manufacture of semiconductor solutions for various electronic applications, particularly in the field of USB connectivity.
FTDI's continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality.
Our main objective is to bridge technologies and provide engineers with highly sophisticated, feature-rich, robust, and user-friendly product platforms.
The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai.
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