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FTDI Chip FT245RNQ-REEL

USB FULL SPEED TO PARALLEL FIFO
part number has RoHS
Manufacturer # :FT245RNQ-REEL
Manufacturer :FTDI Chip
Dasenic # :FT245RNQ-REEL-DS
Customer # :
Description : USB FULL SPEED TO PARALLEL FIFO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.3200$ 4.32
10+$ 3.9150$ 39.15
50+$ 4.3200$ 216
100+$ 3.5550$ 355.5
250+$ 3.1950$ 798.75
In Stock: 7200
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.32
Total :$ 4.32
Delivery :
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Payment :
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FT245RNQ-REEL information

  • FTDI Chip FT245RNQ-REEL technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Controllers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Package / Case:32-VFQFN Exposed Pad
  • Current - Supply:15mA
  • Functions:Bridge, USB to FIFO
  • Interface:FIFO
  • Supplier Device Package:32-QFN (5x5)
  • Standards:USB 2.0
  • Voltage - Supply:3.3V ~ 5.25V
  • Protocol:USB
  • Packaging:Tape & Reel (TR)
  • Packaging:Cut Tape (CT)
  • Packaging:Dasenic-Reel®
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FT245RNQ-REEL provided by FTDI Chip
Founded in 1992, FTDI (Future Technology Devices International Limited) Chip is a company that specializes in the design and manufacture of semiconductor solutions for various electronic applications, particularly in the field of USB connectivity. FTDI's continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality. Our main objective is to bridge technologies and provide engineers with highly sophisticated, feature-rich, robust, and user-friendly product platforms. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai.
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