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FTDI Chip FT245RNL-REEL

Name: FT245RNL-REEL
Brand: FTDI Chip
SKU: FT245RNL-REEL-DS
Price: 4.2606 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 14177

MOQ: 1

5 Price Tiers

Mfr.Part # :FT245RNL-REEL
Manufacturer :FTDI Chip
Dasenic # :FT245RNL-REEL-DS
Datasheet : FT245RNL-REEL Datasheet PDF
Description : USB FULL SPEED TO PARALLEL FIFO
Package :-
Unit Price: $4.2606
Total: $4.26

Quantity	Unit Price	You Save
1-2	$4.2606	-
3-10	$3.8691	9.2% save
11-50	$3.6243	14.9% save
51-100	$3.4173	19.8% save
101-250	$3.0465	28.5% save

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FTDI Chip FT245RNL-REEL technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Controllers Interface

Product Status:Active

Operating Temperature:-40°C ~ 85°C (TA)

Package / Case:28-SSOP (0.209", 5.30mm Width)

Current - Supply:15mA

Functions:Bridge, USB to FIFO

Interface:FIFO

Supplier Device Package:28-SSOP

Standards:USB 2.0

Voltage - Supply:3.3V ~ 5.25V

Protocol:USB

Packaging:Tape & Reel (TR)

Packaging:Cut Tape (CT)

Packaging:Dasenic-Reel®

EU RoHS Status:ROHS3 Compliant

MSL Rating:3 (168 Hours,30°C/60%RH)

US ECCN:EAR99

HTS US:8542.39.0001

REACH Status:REACH is not affected

China RoHS Status:Green Symbol: Green and environmentally friendly product

FT245RNL-REEL provided by FTDI Chip

Founded in 1992, FTDI (Future Technology Devices International Limited) Chip is a company that specializes in the design and manufacture of semiconductor solutions for various electronic applications, particularly in the field of USB connectivity.

FTDI's continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality.

Our main objective is to bridge technologies and provide engineers with highly sophisticated, feature-rich, robust, and user-friendly product platforms.

The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai.