FTDI Chip FT232HQ-TRAY

Name: FT232HQ-TRAY
Brand: FTDI Chip
SKU: FT232HQ-TRAY-DS
Price: 3.6810 USD
Availability: InStock
Rating: 4.8 (42 reviews)

in_stock: 5061

MOQ: 1

4 Price Tiers

Manufacturer_part :FT232HQ-TRAY
Manufacturer :FTDI Chip
Dasenic_Part :FT232HQ-TRAY-DS
Datasheet : FT232HQ-TRAY Datasheet PDF
Description : IC HS USB TO UART/FIFO 48QFN
package :-
unit_price: $3.6810
total: $3.68

Quantity	unit_price	You Save
1-1	$3.6810	-
2-10	$3.5370	3.9% save
11-50	$3.2040	13.0% save
51-100	$3.1500	14.4% save

save_cost

Strict_Quality

Fast_delivery

After_sales

FTDI Chip FT232HQ-TRAY technical_specifications

Category:Integrated Circuits (ICs)/Controllers Interface

Product Status:Active

Operating Temperature:-40°C ~ 85°C

Package / Case:48-VFQFN Exposed Pad

Current - Supply:24mA

Functions:Bridge, USB to UART,FIFO

Interface:UART, FIFO

Supplier Device Package:48-QFN (8x8)

Standards:USB 2.0

Voltage - Supply:1.62V ~ 1.98V, 2.97V ~ 3.63V

Protocol:USB

Base Product Number:FT232HQ

Packaging:Tray

EU RoHS Status:ROHS3 Compliant

MSL Rating:3 (168 Hours,30°C/60%RH)

REACH Status:REACH Unaffected

US ECCN:EAR99

HTS US:8542.39.0001

China RoHS Status:Green Symbol: Green and environmentally friendly product

FT232HQ-TRAY provided by FTDI Chip

Founded in 1992, FTDI (Future Technology Devices International Limited) Chip is a company that specializes in the design and manufacture of semiconductor solutions for various electronic applications, particularly in the field of USB connectivity.

FTDI's continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality.

Our main objective is to bridge technologies and provide engineers with highly sophisticated, feature-rich, robust, and user-friendly product platforms.

The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai.