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FTDI Chip FT232BL-TRAY

USB-to-UART 1-CH 128byte FIFO 5V 32-Pin LQFP Tray
part number has RoHS
Manufacturer # :FT232BL-TRAY
Manufacturer :FTDI Chip
Dasenic # :FT232BL-TRAY-DS
Customer # :
Description : USB-to-UART 1-CH 128byte FIFO 5V 32-Pin LQFP Tray
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 4.9821$ 49.82
20+$ 4.6607$ 93.21
30+$ 4.5000$ 135
44+$ 4.1786$ 183.86
56+$ 4.0179$ 225
In Stock: 20136
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.9821
Total :$ 4.98
Delivery :
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FT232BL-TRAY information

  • FTDI Chip FT232BL-TRAY technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Controllers
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Package / Case:32-LQFP
  • Current - Supply:25mA
  • Functions:Bridge, USB to UART
  • Interface:UART
  • Supplier Device Package:32-LQFP (7x7)
  • Standards:USB 2.0
  • Voltage - Supply:4.35V ~ 5.25V
  • Protocol:USB
  • Series:USBmadeEZ-UART
  • Base Product Number:FT232
  • Packaging:Tray
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FT232BL-TRAY provided by FTDI Chip
Founded in 1992, FTDI (Future Technology Devices International Limited) Chip is a company that specializes in the design and manufacture of semiconductor solutions for various electronic applications, particularly in the field of USB connectivity. FTDI's continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality. Our main objective is to bridge technologies and provide engineers with highly sophisticated, feature-rich, robust, and user-friendly product platforms. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai.
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