Name: DLP-RF1-Z-G
Brand: FTDI Chip
SKU: DS-9797027
Price: 125.44 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $125.4400

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FTDI Chip DLP-RF1-Z-G

USB BASED ZIGBEE DEVELOPMENT MOD

Manufacturer # :DLP-RF1-Z-G

Manufacturer :FTDI Chip

Dasenic # :DLP-RF1-Z-G-DS

Datasheet :

DLP-RF1-Z-G Datasheet

Customer # :

Customer #

Description : USB BASED ZIGBEE DEVELOPMENT MOD

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Quantity	Unit Price	Total
1+	$ 125.4400	$ 125.44

In Stock: 2650

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 125.44

Total :$ 125.44

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Payment :

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DLP-RF1-Z-G information

FTDI Chip DLP-RF1-Z-G technical specifications, attributes, parameters.
Category:RF and Wireless/RF Transceiver Modules and Modems
Product Status:Not For New Designs
Frequency:2.4GHz ~ 2.48GHz
Protocol:Zigbee®
Series:DLP-RF1
Mounting Type:Through Hole
Serial Interfaces:USB
Antenna Type:PCB Trace
R F Family/ Standard:802.15.4
Power- Output:3.5dBm
Utilized I C/ Part:MC13193
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for FTDI Chip DLP-RF1-Z-G
Datasheet:
DLP-RF1-Z-G,

FTDI Chip DLP-RF1-Z-G Environmental and export classification status description

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

DLP-RF1-Z-G provided by FTDI Chip

Founded in 1992, FTDI (Future Technology Devices International Limited) Chip is a company that specializes in the design and manufacture of semiconductor solutions for various electronic applications, particularly in the field of USB connectivity. FTDI's continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality. Our main objective is to bridge technologies and provide engineers with highly sophisticated, feature-rich, robust, and user-friendly product platforms. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai.