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1 : $16.1100
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FTDI Chip DB9-USB-D3-M
Interface Modules USB Mini-B Male 3.3V DB9 Interface
Manufacturer # :DB9-USB-D3-M
Manufacturer :FTDI Chip
Dasenic # :DB9-USB-D3-M-DS
Datasheet :
DB9-USB-D3-M Datasheet
DB9-USB-D3-M DatasheetCustomer # :
Description : Interface Modules USB Mini-B Male 3.3V DB9 Interface
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 16.1100 | $ 16.11 |
| 10+ | $ 14.9490 | $ 149.49 |
| 50+ | $ 14.7600 | $ 738 |
| 250+ | $ 14.7510 | $ 3687.75 |
| 500+ | $ 13.9770 | $ 6988.5 |
In Stock: 1908
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 16.11
Total :$ 16.11
Delivery :
Payment :
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DB9-USB-D3-M information
FTDI Chip DB9-USB-D3-M technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Modules
- Product Status:Active
- Features:D-Shaped Housing
- Type:USB to Serial
- Interface:UART
- Convert From ( Adapter End):USB - Mini B 2.0 Female
- Convert To ( Adapter End):D-Sub 09 Pos (DB9) Male
- Utilized I C / Part:FT232R
- Packaging:Bulk
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DB9-USB-D3-M provided by FTDI Chip
Founded in 1992, FTDI (Future Technology Devices International Limited) Chip is a company that specializes in the design and manufacture of semiconductor solutions for various electronic applications, particularly in the field of USB connectivity.
FTDI's continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality.
Our main objective is to bridge technologies and provide engineers with highly sophisticated, feature-rich, robust, and user-friendly product platforms.
The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai.
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