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1 : $175.8240
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Rochester Electronics MC7410VU500LE
RISC MICROPROCESSOR, 32 BIT, POW
Manufacturer # :MC7410VU500LE
Manufacturer :Rochester Electronics
Dasenic # :MC7410VU500LE-DS
Datasheet :
MC7410VU500LE Datasheet
MC7410VU500LE DatasheetCustomer # :
Description : RISC MICROPROCESSOR, 32 BIT, POW
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 175.8240 | $ 175.82 |
| 5+ | $ 174.6360 | $ 873.18 |
In Stock: 1573
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 175.824
Total :$ 175.82
Delivery :
Payment :
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MC7410VU500LE information
Rochester Electronics MC7410VU500LE technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Operating Temperature:0°C ~ 105°C (TA)
- Package / Case:360-BCBGA, FCCBGA
- Supplier Device Package:360-CBGA (25x25)
- Voltage - I/ O:1.8V, 2.5V, 3.3V
- Speed:500MHz
- Core Processor:PowerPC G4
- Number of Cores/ Bus Width:1 Core, 32-Bit
- Co- Processors/ D S P:-
- R A M Controllers:-
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- S A T A:-
- U S B:-
- Security Features:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MC7410VU500LE provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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