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Rochester Electronics HCPL2630SM
Manufacturer # :HCPL2630SM
Manufacturer :Rochester Electronics
Dasenic # :HCPL2630SM-DS
Datasheet : HCPL2630SM Datasheet
Customer # :
Description : LOGIC IC OUTPUT OPTOCOUPLER, 2-E
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 3906
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.889
Total :$ 2.89
Delivery :
Payment :
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HCPL2630SM information
Rochester Electronics HCPL2630SM technical specifications, attributes, parameters.
- Category:Isolators/Optoisolators - Logic Output
- Product Status:Active
- Operating Temperature:-40°C ~ 110°C
- Mounting Type:Surface Mount
- Package / Case:8-SMD, Gull Wing
- Input Type:DC
- Output Type:Open Collector
- Number of Channels:2
- Supplier Device Package:8-SMD
- Voltage - Supply:4.5V ~ 5.5V
- Data Rate:10Mbps
- Current - Output / Channel:25 mA
- Voltage - Isolation:5000Vrms
- Rise / Fall Time ( Typ):30ns, 10ns
- Inputs - Side 1/ Side 2:2/0
- Common Mode Transient Immunity ( Min):10kV/µs (Typ)
- Propagation Delay tp L H / tp H L ( Max):75ns, 75ns
- Voltage - Forward ( Vf) ( Typ):1.45V
- Current - D C Forward ( If) ( Max):30mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.49.8000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HCPL2630SM provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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