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Rochester Electronics FOD3150V
Manufacturer # :FOD3150V
Manufacturer :Rochester Electronics
Dasenic # :FOD3150V-DS
Datasheet : FOD3150V Datasheet
Customer # :
Description : FET OUTPUT OPTOCOUPLER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 5505
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7442
Total :$ 0.74
Delivery :
Payment :
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FOD3150V information
Rochester Electronics FOD3150V technical specifications, attributes, parameters.
- Category:Isolators/Isolator Gate Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 100°C
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Technology:Optical Coupling
- Approval Agency:IEC, UL
- Number of Channels:1
- Supplier Device Package:8-DIP
- Current - Output High, Low:1A, 1A
- Voltage - Isolation:5000Vrms
- Current - Peak Output:1.5A
- Rise / Fall Time ( Typ):60ns, 60ns
- Common Mode Transient Immunity ( Min):20kV/µs
- Propagation Delay tp L H / tp H L ( Max):500ns, 500ns
- Pulse Width Distortion ( Max):300ns
- Voltage - Forward ( Vf) ( Typ):1.5V
- Current - D C Forward ( If) ( Max):25 mA
- Voltage - Output Supply:15V ~ 30V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.49.8000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FOD3150V provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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