Name: P100 656
Brand: ESPROS Photonics AG
SKU: DS-8071503
Availability: InStock
Rating: 4.8 (3 reviews)

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ESPROS Photonics AG P100 656

TOFCAM-660-WF

Manufacturer # :P100 656

Manufacturer :ESPROS Photonics AG

Dasenic # :P100 656-DS

Datasheet :

P100 656 Datasheet

Customer # :

Customer #

Description : TOFCAM-660-WF

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Quantity

Unit Price

Total

In Stock: 3000

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

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Unit Price :$ 0

Total :$ 0.00

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P100 656 information

ESPROS Photonics AG P100 656 technical specifications, attributes, parameters.
Category:Sensor Devices/Optical Sensors - Camera Modules
Product Status:Active
Color:-
Mounting Type:Chassis Mount
Package / Case:Module
Size / Dimension:5.354" L x 3.504" W (136.00mm x 89.00mm)
Type:3D Time of Flight
Height ( Max):0.078" (1.97mm)
Interface:RJ45
Supplier Device Package:Module
Resolution:320 x 240
Frames per Second:40
Shutter:-
Lens Mount:-
Sensor:epc660
Pixel Size:-
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for ESPROS Photonics AG P100 656
Datasheet:
P100 656,

ESPROS Photonics AG P100 656 Environmental and export classification status description

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

P100 656 provided by ESPROS Photonics AG

ESPROS Photonics Corporation is a photonics technology company located in Switzerland, with subsidiaries in China and the USA. The company is built around a unique CMOS/CCD process developed and owned by ESPROS. Products are TOF and LiDAR imagers as well as custom ASICS. We also develop and produce 3D camera modules, all based on our own 3D imagers. Our highly skilled international workforce consists of a broad range of experts in semiconductor physics, semiconductor processing, TCAD, mixed signal IC design, electronics hardware, microcontroller firmware, image processing software, application software, mechanics, optics, camera module assembly, reliability, etc. We serve our customers with the only non-captive high performance CMOS process with optical frontend worldwide.