Name: EPC137-CSP6-D
Brand: ESPROS Photonics AG
SKU: DS-8021090
Price: 2.5694 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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ESPROS Photonics AG EPC137-CSP6-D

IC PHOTODIODE AMP

Manufacturer # :EPC137-CSP6-D

Manufacturer :ESPROS Photonics AG

Dasenic # :EPC137-CSP6-D-DS

Datasheet :

EPC137-CSP6-D Datasheet

Customer # :

Customer #

Description : IC PHOTODIODE AMP

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Quantity	Unit Price	Total
10+	$ 2.5694	$ 25.69
250+	$ 2.1412	$ 535.3
500+	$ 1.8736	$ 936.8
1250+	$ 2.1412	$ 2676.5
2500+	$ 1.4453	$ 3613.25

In Stock: 2385

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 2.5694

Total :$ 2.57

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EPC137-CSP6-D information

ESPROS Photonics AG EPC137-CSP6-D technical specifications, attributes, parameters.
Category:Sensor Devices/Amplifiers
Product Status:Active
Operating Temperature:-40°C ~ 85°C
Mounting Type:Chassis Mount
Current - Supply:800 µA
Output Type:Digital
Voltage - Supply:4V ~ 5.2V
Amplifier Type:General Purpose
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for ESPROS Photonics AG EPC137-CSP6-D
Datasheet:
EPC137-CSP6-D,

ESPROS Photonics AG EPC137-CSP6-D Environmental and export classification status description

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

EPC137-CSP6-D provided by ESPROS Photonics AG

ESPROS Photonics Corporation is a photonics technology company located in Switzerland, with subsidiaries in China and the USA. The company is built around a unique CMOS/CCD process developed and owned by ESPROS. Products are TOF and LiDAR imagers as well as custom ASICS. We also develop and produce 3D camera modules, all based on our own 3D imagers. Our highly skilled international workforce consists of a broad range of experts in semiconductor physics, semiconductor processing, TCAD, mixed signal IC design, electronics hardware, microcontroller firmware, image processing software, application software, mechanics, optics, camera module assembly, reliability, etc. We serve our customers with the only non-captive high performance CMOS process with optical frontend worldwide.