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Rochester Electronics WM9001GEFL/R
CONSUMER CIRCUIT, CMOS, PQCC16
Manufacturer # :WM9001GEFL/R
Manufacturer :Rochester Electronics
Dasenic # :WM9001GEFL/R-DS
Datasheet :
WM9001GEFL/R Datasheet
WM9001GEFL/R DatasheetCustomer # :
Description : CONSUMER CIRCUIT, CMOS, PQCC16
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.9990 | $ 1 |
| 25+ | $ 0.9810 | $ 24.53 |
| 100+ | $ 0.9360 | $ 93.6 |
| 500+ | $ 0.8991 | $ 449.55 |
| 1000+ | $ 0.8492 | $ 849.2 |
In Stock: 37148
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.999
Total :$ 1.00
Delivery :
Payment :
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WM9001GEFL/R information
Rochester Electronics WM9001GEFL/R technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Depop, Thermal Protection
- Mounting Type:Surface Mount
- Package / Case:16-WFQFN Exposed Pad
- Type:Class D, Class AB
- Output Type:1-Channel (Mono)
- Supplier Device Package:16-QFN (3x3)
- Voltage - Supply:2.7V ~ 5.5V
- Max Output Power x Channels @ Load:-
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
WM9001GEFL/R provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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