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1 : $200.0036
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CEVA Hillcrest Labs FSM-9 OEM
IMU MODULE 3D CALIBRATED USB/SPI
Manufacturer # :FSM-9 OEM
Manufacturer :CEVA Hillcrest Labs
Dasenic # :FSM-9 OEM-DS
Datasheet :
FSM-9 OEM Datasheet
FSM-9 OEM DatasheetCustomer # :
Description : IMU MODULE 3D CALIBRATED USB/SPI
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 200.0036 | $ 200 |
| 200+ | $ 77.3998 | $ 15479.96 |
| 500+ | $ 74.6794 | $ 37339.7 |
| 1000+ | $ 73.3349 | $ 73334.9 |
In Stock: 43
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 200.0036
Total :$ 200.00
Delivery :
Payment :
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FSM-9 OEM information
CEVA Hillcrest Labs FSM-9 OEM technical specifications, attributes, parameters.
- Category:Sensor Devices/Motion Sensors - IMUs (Inertial Measurement Units)
- Product Status:Obsolete
- Operating Temperature:0°C ~ 50°C
- Mounting Type:Surface Mount
- Package / Case:10-SMD Module
- Output Type:SPI, USB
- Supplier Device Package:Module
- Sensor Type:Accelerometer, Gyroscope, Magnetometer, 9 Axis
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FSM-9 OEM provided by CEVA Hillcrest Labs
CEVA’s Hillcrest Labs team is a leading global supplier of software, components and intellectual property to enable the intelligent use of sensors in consumer electronics, robotics and IoT devices.
For more than 15 years, this team has delivered innovative solutions that combine IMU sensors and sensor fusion technology to power a wide variety of consumer electronics, as well as commercial and industrial products.
CEVA’s advanced sensor fusion technology transforms human and machine movement into high quality, application-ready information that enables developers and manufacturers to create everyday products that work with precision.
Today, CEVA’s proven Hillcrest Labs MotionEngineTM sensor fusion software is used in a wide variety of applications, including robotics, PC’s, motion controllers, hearables, virtual reality (VR), augmented reality (AR), 3D audio, wearables, smart phones, and IoT devices.
Headquartered in Rockville, Maryland, CEVA has more than 490 employees worldwide. To date, more than 15 billion CEVA-powered chips have been shipped worldwide, for a wide range of diverse end markets. CEVA is traded on the NASDAQ Global Market (Ticker: CEVA).
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