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Rochester Electronics TIP121

TRANS NPN DARL 80V 5A TO220AB
part number has RoHS
Manufacturer # :TIP121
Manufacturer :Rochester Electronics
Dasenic # :TIP121-DS
Customer # :
Description : TRANS NPN DARL 80V 5A TO220AB
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
3+$ 0.2376$ 0.71
10+$ 0.1881$ 1.88
50+$ 0.1746$ 8.73
250+$ 0.1656$ 41.4
1000+$ 0.1494$ 149.4
In Stock: 7871
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2376
Total :$ 0.24
Delivery :
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Payment :
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TIP121 information

  • Rochester Electronics TIP121 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
  • Product Status:Active
  • Operating Temperature:150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3
  • Power - Max:2 W
  • Supplier Device Package:TO-220AB
  • Transistor Type:NPN - Darlington
  • Current - Collector ( Ic) ( Max):5 A
  • Voltage - Collector Emitter Breakdown ( Max):80 V
  • Vce Saturation ( Max) @ Ib, Ic:4V @ 20mA, 5A
  • Current - Collector Cutoff ( Max):500µA
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:1000 @ 3A, 3V
  • Frequency - Transition:-
  • EU RoHS Status:RoHS non-compliant
  • US ECCN:EAR99
  • HTS US:8541.29.0095
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TIP121 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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