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Rochester Electronics TIP111

TRANS NPN DARL 80V 2A TO220-3
part number has RoHS
Manufacturer # :TIP111
Manufacturer :Rochester Electronics
Dasenic # :TIP111-DS
Customer # :
Description : TRANS NPN DARL 80V 2A TO220-3
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.2457$ 0.25
25+$ 0.2408$ 6.02
100+$ 0.2309$ 23.09
500+$ 0.2211$ 110.55
1000+$ 0.2089$ 208.9
In Stock: 8848
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2457
Total :$ 0.25
Delivery :
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Payment :
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TIP111 information

  • Rochester Electronics TIP111 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
  • Product Status:Obsolete
  • Operating Temperature:-65°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3
  • Power - Max:50 W
  • Supplier Device Package:TO-220-3
  • Transistor Type:NPN - Darlington
  • Current - Collector ( Ic) ( Max):2 A
  • Voltage - Collector Emitter Breakdown ( Max):80 V
  • Vce Saturation ( Max) @ Ib, Ic:2.5V @ 8mA, 2A
  • Current - Collector Cutoff ( Max):2mA
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:1000 @ 1A, 4V
  • Frequency - Transition:25MHz
  • EU RoHS Status:RoHS non-compliant
  • US ECCN:EAR99
  • HTS US:8541.29.0095
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TIP111 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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