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Bourns TISP7180F3DR-S

THYRISTOR 145V 175A 8SOIC
part number has RoHS
Manufacturer # :TISP7180F3DR-S
Manufacturer :Bourns
Dasenic # :TISP7180F3DR-S-DS
Customer # :
Description : THYRISTOR 145V 175A 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.6907$ 6.91
5000+$ 0.3837$ 1918.5
10000+$ 0.3833$ 3833
15000+$ 0.3821$ 5731.5
20000+$ 0.3812$ 7624
In Stock: 10146
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6907
Total :$ 0.69
Delivery :
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TISP7180F3DR-S information

  • Bourns TISP7180F3DR-S technical specifications, attributes, parameters.
  • Category:Circuit Protection Devices/TVS - Thyristors
  • Product Status:Active
  • Capacitance:47pF
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Current - Peak Pulse (10/1000µs):45 A
  • Voltage - Breakover:180V
  • Voltage - Off State:145V
  • Current - Peak Pulse (8/20µs):175 A
  • Current - Hold ( Ih):150 mA
  • Number of Elements:3
  • Voltage - On State:5 V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TISP7180F3DR-S provided by Bourns
Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products. Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments. Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A. One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.
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