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Bourns SF-0603FP400F-2
Manufacturer # :SF-0603FP400F-2
Manufacturer :Bourns
Dasenic # :SF-0603FP400F-2-DS
Datasheet : SF-0603FP400F-2 Datasheet
Customer # :
Description : FUSE BRD MNT 4A 24VAC/35VDC 0603
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 7835
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.576
Total :$ 0.58
Delivery :
Payment :
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SF-0603FP400F-2 information
Bourns SF-0603FP400F-2 technical specifications, attributes, parameters.
- Category:Circuit Protection Devices/Fuses
- Product Status:Active
- Color:-
- Operating Temperature:-55°C ~ 90°C
- Mounting Type:Surface Mount
- Package / Case:0603 (1608 Metric)
- Size / Dimension:0.063" L x 0.032" W x 0.012" H (1.60mm x 0.81mm x 0.30mm)
- Approval Agency:UL
- Current Rating ( Amps):4 A
- Voltage Rating - A C:24 V
- Voltage Rating - D C:35 V
- Fuse Type:Board Mount (Cartridge Style Excluded)
- Response Time:Fast Blow
- Breaking Capacity @ Rated Voltage:50A AC, 35A DC
- Melting I²t:0.63
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SF-0603FP400F-2 provided by Bourns
Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products.
Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments.
Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A.
One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.
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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.