Bourns CDNBS08-T05C

Name: CDNBS08-T05C
Brand: Bourns
SKU: CDNBS08-T05C-DS
Price: 2.1240 USD
Availability: InStock
Rating: 4.8 (42 reviews)

in_stock: 15048

MOQ: 1

5 Price Tiers

Manufacturer_part :CDNBS08-T05C
Manufacturer :Bourns
Dasenic_Part :CDNBS08-T05C-DS
Datasheet : CDNBS08-T05C Datasheet PDF
Description : TVS DIODE 5VWM 13.5VC 8-SOIC 8-SOIC (0.154", 3.90mm Width)
package :8-SOIC (0.154", 3.90mm Width)
unit_price: $2.1240
total: $2.12

Quantity	unit_price	You Save
1-1	$2.1240	-
2-10	$1.5480	27.1% save
11-100	$1.1160	47.5% save
101-500	$0.9270	56.4% save
501-1000	$0.8559	59.7% save

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Bourns CDNBS08-T05C technical_specifications

Category:Circuit Protection Devices/TVS - Diodes

Product Status:Active

Operating Temperature:-55°C ~ 150°C (TJ)

Mounting Type:Surface Mount

Package / Case:8-SOIC (0.154", 3.90mm Width)

Type:Zener

Capacitance @ Frequency:308pF @ 1MHz

Supplier Device Package:8-SOIC

Unidirectional Channels:-

Voltage - Reverse Standoff ( Typ):5V

Voltage - Breakdown ( Min):6V

Voltage - Clamping ( Max) @ Ipp:13.5V (Typ)

Current - Peak Pulse (10/1000µs):42A (8/20µs)

Power - Peak Pulse:500W

Power Line Protection:No

Bidirectional Channels:4

Applications:General Purpose

CDNBS08-T05C provided by Bourns

Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products. Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments. Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A. One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.