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Bourns 1.5SMC6.8CA-Q
Manufacturer # :1.5SMC6.8CA-Q
Manufacturer :Bourns
Dasenic # :1.5SMC6.8CA-Q-DS
Datasheet : 1.5SMC6.8CA-Q Datasheet
Customer # :
Description : DIO TVS VRWM 6.8V 1500W BIDIR SM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 22204
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.729
Total :$ 0.73
Delivery :
Payment :
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1.5SMC6.8CA-Q information
Bourns 1.5SMC6.8CA-Q technical specifications, attributes, parameters.
- Category:Circuit Protection Devices/TVS - Diodes
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:DO-214AB, SMC
- Type:Zener
- Capacitance @ Frequency:-
- Supplier Device Package:DO-214AB (SMC)
- Unidirectional Channels:-
- Voltage - Reverse Standoff ( Typ):5.8V
- Voltage - Breakdown ( Min):6.45V
- Voltage - Clamping ( Max) @ Ipp:10.5V
- Current - Peak Pulse (10/1000µs):144.8A
- Power - Peak Pulse:1500W (1.5kW)
- Power Line Protection:No
- Bidirectional Channels:1
- Applications:Automotive, Telecom
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
1.5SMC6.8CA-Q provided by Bourns
Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products.
Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments.
Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A.
One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.
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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.