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Rochester Electronics PTH12060LAZ
Manufacturer # :PTH12060LAZ
Manufacturer :Rochester Electronics
Dasenic # :PTH12060LAZ-DS
Datasheet : PTH12060LAZ Datasheet
Customer # :
Description : DC DC CONVERTER 0.8-1.8V 18W
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1530
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 18.4887
Total :$ 18.49
Delivery :
Payment :
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PTH12060LAZ information
Rochester Electronics PTH12060LAZ technical specifications, attributes, parameters.
- Category:Board-Mount Power Supplies/DC DC Converters
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Features:Remote On/Off, OCP, UVLO
- Mounting Type:Surface Mount
- Package / Case:10-SMD Module
- Size / Dimension:0.99" L x 0.62" W x 0.38" H (25.3mm x 15.8mm x 9.6mm)
- Approval Agency:-
- Type:Non-Isolated PoL Module
- Voltage - Input ( Max):13.2V
- Supplier Device Package:-
- Power ( Watts):-
- Number of Outputs:1
- Voltage - Isolation:-
- Control Features:-
- Current - Output ( Max):10A
- Voltage - Input ( Min):10.8V
- Voltage - Output 1:0.8 ~ 1.8V
- Voltage - Output 2:-
- Voltage - Output 3:-
- Voltage - Output 4:-
- Efficiency:88%
- Standard Number:-
- Applications:ITE (Commercial)
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
PTH12060LAZ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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