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Rochester Electronics PTH03010WAS
Manufacturer # :PTH03010WAS
Manufacturer :Rochester Electronics
Dasenic # :PTH03010WAS-DS
Datasheet : PTH03010WAS Datasheet
Customer # :
Description : DC DC CONVERTER 0.8-2.5V 38W
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1526
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.9613
Total :$ 8.96
Delivery :
Payment :
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PTH03010WAS information
Rochester Electronics PTH03010WAS technical specifications, attributes, parameters.
- Category:Board-Mount Power Supplies/DC DC Converters
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Features:Remote On/Off, OCP, OTP, UVLO
- Mounting Type:Surface Mount
- Package / Case:10-SMD Module
- Size / Dimension:1.37" L x 0.62" W x 0.38" H (34.8mm x 15.8mm x 9.6mm)
- Approval Agency:-
- Type:Non-Isolated PoL Module
- Voltage - Input ( Max):3.65V
- Supplier Device Package:-
- Power ( Watts):-
- Number of Outputs:1
- Voltage - Isolation:-
- Control Features:-
- Current - Output ( Max):15A
- Voltage - Input ( Min):2.95V
- Voltage - Output 1:0.8 ~ 2.5V
- Voltage - Output 2:-
- Voltage - Output 3:-
- Voltage - Output 4:-
- Efficiency:93%
- Standard Number:-
- Applications:ITE (Commercial)
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
PTH03010WAS provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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