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Aries Electronics 30-820-90C

CONN IC DIP SOCKET 30POS GOLD
part number has RoHS
Manufacturer # :30-820-90C
Manufacturer :Aries Electronics
Dasenic # :30-820-90C-DS
Customer # :
Description : CONN IC DIP SOCKET 30POS GOLD
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
37+$ 26.0957$ 965.54
In Stock: 1692
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 26.0957
Total :$ 26.10
Delivery :
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30-820-90C information

  • Aries Electronics 30-820-90C technical specifications, attributes, parameters.
  • Category:Connectors & Interconnects/Sockets for ICs, Transistors
  • Product Status:Active
  • Operating Temperature:-55°C ~ 105°C
  • Features:Closed Frame
  • Mounting Type:Through Hole, Right Angle, Horizontal
  • Termination:Solder
  • Type:DIP, 0.3" (7.62mm) Row Spacing
  • Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:30.0µin (0.76µm)
  • Contact Finish - Post:Tin
  • Number of Positions or Pins ( Grid):30 (2 x 15)
  • Pitch - Post:0.100" (2.54mm)
  • Contact Material - Mating:Beryllium Copper
  • Contact Finish Thickness - Post:200.0µin (5.08µm)
  • Contact Material - Post:Brass
30-820-90C provided by Aries Electronics
Aries Electronics, founded in 1972, initially offered IC sockets, headers, and printed circuit cards. Over time, we expanded their product line to include various packaging solutions, such as sockets, headers, covers, programmable devices, and cable assemblies. In recent years, Aries gained recognition for its high-temperature sockets, flexible cables, and Correct-A-Chip® intelligent connectors. We also excel in producing adapters for different termination styles. Aries has patented innovations in BGA and LGA sockets and acquired a high-frequency test and burn-in socket line, expanding their presence in the test socket market. Aries is known for solving packaging challenges and is a leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, offering various specialty electronic connectors.
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