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Aries Electronics 12-3513-10

CONN IC DIP SOCKET 12POS GOLD
part number has RoHS
Manufacturer # :12-3513-10
Manufacturer :Aries Electronics
Dasenic # :12-3513-10-DS
Customer # :
Description : CONN IC DIP SOCKET 12POS GOLD
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 3.6385$ 36.39
317+$ 3.0321$ 961.18
In Stock: 1330
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.6385
Total :$ 3.64
Delivery :
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12-3513-10 information

  • Aries Electronics 12-3513-10 technical specifications, attributes, parameters.
  • Category:Connectors & Interconnects/Sockets for ICs, Transistors
  • Product Status:Active
  • Operating Temperature:-55°C ~ 105°C
  • Features:Closed Frame
  • Mounting Type:Through Hole
  • Termination:Solder
  • Type:DIP, 0.3" (7.62mm) Row Spacing
  • Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:10.0µin (0.25µm)
  • Contact Finish - Post:Tin
  • Number of Positions or Pins ( Grid):12 (2 x 6)
  • Pitch - Post:0.100" (2.54mm)
  • Contact Material - Mating:Beryllium Copper
  • Contact Finish Thickness - Post:200.0µin (5.08µm)
  • Contact Material - Post:Brass
12-3513-10 provided by Aries Electronics
Aries Electronics, founded in 1972, initially offered IC sockets, headers, and printed circuit cards. Over time, we expanded their product line to include various packaging solutions, such as sockets, headers, covers, programmable devices, and cable assemblies. In recent years, Aries gained recognition for its high-temperature sockets, flexible cables, and Correct-A-Chip® intelligent connectors. We also excel in producing adapters for different termination styles. Aries has patented innovations in BGA and LGA sockets and acquired a high-frequency test and burn-in socket line, expanding their presence in the test socket market. Aries is known for solving packaging challenges and is a leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, offering various specialty electronic connectors.
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