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Rochester Electronics DS28DG02G-3C+

IC EEPROM 2KBIT SPI 2MHZ 36TQFN
part number has RoHS
Manufacturer # :DS28DG02G-3C+
Manufacturer :Rochester Electronics
Dasenic # :DS28DG02G-3C+-DS
Customer # :
Description : IC EEPROM 2KBIT SPI 2MHZ 36TQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 61
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
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DS28DG02G-3C+ information

  • Rochester Electronics DS28DG02G-3C+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:36-WFQFN Exposed Pad
  • Technology:EEPROM
  • Supplier Device Package:36-TQFN (6x6)
  • Memory Size:2Kb (256 x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:2.2V ~ 5.25V
  • Clock Frequency:2 MHz
  • Access Time:-
  • Memory Format:EEPROM
  • Memory Interface:SPI
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DS28DG02G-3C+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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