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Rochester Electronics LTM2886CY-3S#PBF
Manufacturer # :LTM2886CY-3S#PBF
Manufacturer :Rochester Electronics
Dasenic # :LTM2886CY-3S#PBF-DS
Datasheet : LTM2886CY-3S#PBF Datasheet
Customer # :
Description : LTM2886 - SPI UMODULE ISOLATOR W
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 26557
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4307
Total :$ 0.43
Delivery :
Payment :
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LTM2886CY-3S#PBF information
Rochester Electronics LTM2886CY-3S#PBF technical specifications, attributes, parameters.
- Category:Isolators/Digital Isolators
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:32-BBGA Module
- Technology:Capacitive Coupling
- Type:SPI
- Number of Channels:6
- Supplier Device Package:32-BGA (15x11.25)
- Voltage - Supply:3V ~ 3.6V
- Data Rate:4MHz, 8MHz
- Channel Type:Unidirectional
- Voltage - Isolation:2500Vrms
- Rise / Fall Time ( Typ):3ns, 3ns
- Isolated Power:Yes
- Inputs - Side 1/ Side 2:3/3
- Common Mode Transient Immunity ( Min):30kV/µs
- Propagation Delay tp L H / tp H L ( Max):100ns, 100ns
- Pulse Width Distortion ( Max):-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LTM2886CY-3S#PBF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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