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1 : $140.3280
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Rochester Electronics HMC749LC3C
IC FF T-TYPE SNGL 1BIT 16SMT
Manufacturer # :HMC749LC3C
Manufacturer :Rochester Electronics
Dasenic # :HMC749LC3C-DS
Datasheet :
HMC749LC3C Datasheet
HMC749LC3C DatasheetCustomer # :
Description : IC FF T-TYPE SNGL 1BIT 16SMT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 140.3280 | $ 140.33 |
| 1000+ | $ 112.2660 | $ 112266 |
In Stock: 6390
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 140.328
Total :$ 140.33
Delivery :
Payment :
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HMC749LC3C information
Rochester Electronics HMC749LC3C technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-LFQFN Exposed Pad
- Type:T-Type
- Output Type:Complementary
- Supplier Device Package:16-SMT (3x3)
- Number of Elements:1
- Voltage - Supply:3V ~ 3.6V
- Clock Frequency:26 GHz
- Number of Bits per Element:1
- Current - Output High, Low:-
- Max Propagation Delay @ V, Max C L:-
- Current - Quiescent ( Iq):-
- Trigger Type:Positive, Negative
- Input Capacitance:-
- Function:Reset
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HMC749LC3C provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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