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Rochester Electronics EPM7128AFC256-7

EE PLD, 7.5NS, 128-CELL PBGA256
part number has RoHS
Manufacturer # :EPM7128AFC256-7
Manufacturer :Rochester Electronics
Dasenic # :EPM7128AFC256-7-DS
Customer # :
Description : EE PLD, 7.5NS, 128-CELL PBGA256
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 17.1540$ 17.15
25+$ 16.8120$ 420.3
100+$ 16.1280$ 1612.8
500+$ 15.4350$ 7717.5
1000+$ 14.5800$ 14580
In Stock: 10500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.154
Total :$ 17.15
Delivery :
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  • Rochester Electronics EPM7128AFC256-7 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/CPLDs (Complex Programmable Logic Devices)
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA
  • Supplier Device Package:256-FBGA (17x17)
  • Programmable Type:EE PLD
  • Delay Time tpd(1) Max:5 ns
  • Voltage Supply - Internal:3V ~ 3.6V
  • Number of Logic Elements/ Blocks:8
  • Number of Macrocells:128
  • Number of I/ O:100
  • Number of gates:2500
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
EPM7128AFC256-7 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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